Oyster Bay, N.Y. – Mill-Max's ball grid array socket/adapter systems can socket both BGA devices and interconnecting circuit boards. BGA socket/adapters provide a high-density and low-profile ...

Manufacturers of ball-grid-array (BGA) burn-in sockets are using a variety of processes to help them keep pace with the testing requirements posed by today's faster and denser integrated circuits.

The Configurable High Insertion Count (CHIC) Socket lets users of programming and automatic test equipment accommodate any BGA package. It improves electrical contact reliability compared to ...

Complying with the Restriction of Hazardous Substances directive and other worldwide initiatives for lead-free manufacturing, the company now offers lead-free solder ball terminal options on select ...

BGA socket adapter provide an inexpensive and reliable interconnect for attaching BGA chips to target board. These adapters have less than half of the insertion force of competitive adapters, shorter ...

GHz BGA & QFN/MLF sockets are ideal for prototyping and testing almost any BGA or QFN device application. These ZIF sockets provide excellent signal integrity yet remain cost effective. Innovative ...

It was almost a year ago when we first heard details about AMD's plans for its top-dog mobile part for Zen 5, which goes by the name Strix Halo. For Zen 5 in laptops, AMD is developing two lines of ...

There's been a bit of he-said/she-said going on with regards to Intel's future desktop roadmaps. Last year, news broke that the company was planning to move to soldered ball grid array (BGA) mounts ...