IC-Link by imec and TSMC offer easier access to advanced chip design technologies and cloud-based design infrastructure.

Imec and TSMC expand collaboration to give chip designers easier access to advanced-node technology, cloud EDA tools and design support.

As the cost of designing leading-edge chips approaches $1 billion, frontier semiconductor design is becoming accessible to ...

Expanded partnership spans TSMC A14 certification, silicon-proven IP on TSMC N3P/N2P, wafer-scale 3D-IC for hundreds of chiplets, and agentic AI flows SAN JOSE, Calif., Sept. 24, 2026 — Cadence has ...

Through TSMC's OIP Cloud Alliance, the collaboration combines secure cloud-based design capabilities with access to advanced node technology and expert support to help innovators bring chips to market ...

Cadence and TSMC are expanding their collaboration by achieving tool certification for the next-gen A14 process technology.

SANTA CLARA, Calif.--(BUSINESS WIRE)--ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced it has closed an oversubscribed $50 million Series A1 ...

Synopsys (SNPS) and Intel (INTC) are fast-tracking customer readiness from silicon to systems for Intel's advanced semiconductor manufacturing process technology 14A. Synopsys expanded collaborations ...

Architect Labs' AI system designed the Redwood inference chip in under two weeks. It runs on an FPGA, but its edge over ...

The most advanced silicon chips have accelerated the development of artificial intelligence. Now can AI return the favor? Cognichip is building a deep learning model to work alongside engineers as ...

KUALA LUMPUR, Sept 4 — Semiconductors are behind much of the technology people use every day, from ...

The third white paper in our series, “Building an AI Chip” delves into the critical aspects of ensuring robust security and efficient software development for AI chips. As AI applications become ...