Researchers from Germany's Forschungszentrum Jülich have demonstrated that heterojunction (HJT) solar cells metalized with copper (Cu) paste or copper-silver (AgCu) paste can achieve efficiency levels ...
A unique methodology to explore alternative interconnect metals for the Ångström era. About five years ago, imec researchers started to explore binary and ternary compounds for replacing Cu as future ...
Researchers in the United States have developed a photonic curing technique using laser sintering to rapidly heat and cure copper pastes on temperature-sensitive solar cell substrates without causing ...
Imec has delivered the first experimental evidence that the resistivity of a thin conductor film on a 300mm Si wafer can be lower than that of Cu and Ru, which are currently used in interconnect ...
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