Defect correlation analysis is a new approach in IC failure analysis technology. Proper failure analysis can provide useful and cost-saving data for companies in control of their design and ...
Several equipment makers are ramping up new inspection equipment to address the growing defect challenges in IC packaging. At one time, finding defects in packaging was relatively straightforward. But ...
WILSONVILLE, Ore.--(BUSINESS WIRE)--Mentor Graphics Corporation (NASDAQ: MENT) today announced evaluation results at Fujitsu Semiconductor Ltd. that shows the Tessent ® YieldInsight ® diagnosis-driven ...
Santa Cruz, Calif. — Pity the IC failure analysis expert. While scan test data provides a starting point for diagnosis, isolating fault locations and identifying defect types is tough. Mentor Graphics ...
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FMEA (Failure Mode and Effects Analysis): A Quick Guide to Minimizing Defects and Faults in Your Projects
Problems and defects are expensive. Customers understandably place high expectations on manufacturers and service providers ...
Czech-based electron microscope manufacturer TESCAN is undergoing a strategic shift, expanding into advanced semiconductor packaging through its growing expertise in failure analysis (FA) technology.
SANTA CRUZ, Calif. Pity the IC failure analysis expert. While scan test data provides a starting point for diagnosis, isolating fault locations and identifying defect types is tough. Mentor Graphics ...
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