Marsha Habib terafiliasi dengan PUSKAPA. Santi Kusumaningrum does not work for, consult, own shares in or receive funding from any company or organization that would benefit from this article, and has ...
A new technical paper titled “Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects” was published by researchers at Siemens EDA, D2S, and Univ.
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