Developed with support from long-time foundry and process technology partner, Taiwan Semiconductor Manufacturing Corporation, BSI methodology involves turning the sensor upside down so that it ...
The quest for superior digital images in evershrinking camera designs never ends. Now, CMOS-sensor specialist OmniVision Technologies has partnered with Taiwan Semiconductor Manufacturing Corp. (TSMC) ...
BSI methodology involves turning the CameraChip (TM) sensor upside down so that it collects light through what was previously the backside of the sensor, the silicon substrate. This approach differs ...
'Our BSI technology will greatly enhance the range of imaging solutions afforded to our customers starting with the 1.1-micron and 1.4-micron sensors,' said Farshid Sabet, Vice President and General ...
Collecting light through the backside of a CMOS sensor allows OmniVision to extend its pixel roadmap down to 0.9 microns. OminVision and its partner Taiwan Semiconductor Manufacturing Corporation ...
Omnivision has introduced three new back-side illuminated (BSI) global shutter (GS) image sensors for machine-vision applications including industrial automation, robotics, logistics barcode scanners ...
BARCELONA, Spain & SAN JOSE, Calif.--(BUSINESS WIRE)--Aptina, a leading innovator of CMOS imaging technology, today announced that it will be showing its new 1.1 and 1.4-micron backside illumination ...
BARCELONA, Spain & SAN JOSE, Calif.--(BUSINESS WIRE)--Aptina, a leading innovator of CMOS imaging technology, today announced that it will be showing its new 1.1 and 1.4-micron backside illumination ...
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