Finfet technology, with its 3D structure, is seen as the key semiconductor technology for the next generation of deep sub-micron chip design. Leah Schuth describes how physical IP developers will rise ...

Chipmakers face a multitude of challenges in the fab at 10nm/7nm and beyond, but one technology that is typically under the radar is becoming especially difficult—metrology. Metrology, the art of ...

As the need to scale transistors to ever-smaller sizes continues to press on technology designers, the impact of parasitic resistance and capacitance can approach or even outpace other aspects of ...

SEOUL, South Korea -- February 15, 2015 --Samsung Electronics Co., Ltd., a world leader in advanced semiconductor solutions, announced that it has begun mass production of industry’s first mobile ...