Infineon has announced 650V silicon carbide mosfets in 7pin D2PAK surface-mount packages, aimed at servers, telecoms. electric vehicle charging and solar energy. “Trench technology is the basis for ...
The TOLG (right) package is intended to combines the best features of Infineon’s existing TOLL package (TO-leadless) and the 7pin D2PAK, sharing the same 10 x 11mm footprint and electrical ...
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