SPHBM4 cuts pin counts dramatically while preserving hyperscale-class bandwidth performanceOrganic substrates reduce ...
An insatiable demand for bandwidth in everything from high-performance computing to AI training, gaming, and automotive applications is fueling the development of the next generation of high-bandwidth ...
AMD is finally willing to talk about its high bandwidth memory solution. It'll arrive in the not-too-distant future -- with significantly improved graphics performance. Share on Facebook (opens in a ...
Embedded-system designs continue to demand more and faster memory, especially in platforms like FPGAs, GPUs, and CPUs. High bandwidth memory (HBM) delivers more data in one clock cycle because of its ...
The impact of AI/ML grows daily impacting every industry and touching the lives of everyone. In marketing, healthcare, retail, transportation, manufacturing and more, AI/ML is a catalyst for great ...
Synopsys has launched what it said is the industry’s first complete HBM3 IP solution, including controller, PHY, and verification IP for 2.5D multi-die package systems. HBM3 technology helps designers ...
Advanced IC packaging is a prominent technology highlight of the “More than Moore” arena. At a time when chip scaling is becoming more difficult and expensive at each node, engineers are putting ...
We've discussed the capabilities and performance of HBM (High Bandwidth Memory) multiple times over the past six months, but a new report sheds light on the physical architecture and construction of ...
SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced the immediate availability of its next-generation 2.5D ...
SAN JOSE, Calif., Aug. 29, 2025 (GLOBE NEWSWIRE) -- POET Technologies Inc. ("POET " or the "Company ") (NASDAQ: POET), a leader in the design and implementation of highly-integrated optical engines ...
MOUNTAIN VIEW, Calif., Oct. 22, 2020 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) today announced that its 3DIC Compiler solution enabled Samsung Foundry to design, implement and tape out a complex 5 ...
Advanced IC packaging is a prominent technology highlight of the “More than Moore” arena. At a time when chip scaling is becoming more difficult and expensive at each node, engineers are putting ...
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