SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced component solutions, has introduced new chip-on-board (COB) LED package lineups, including small LES ...

SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced component solutions, today introduced new chip-on-board (COB) LED package products, the LC006B and LC008B ...

New worlds of LED lighting are revealing themselves, worlds we couldn’t dream about just a few years ago… When Citizen created the “Monster” COB package CLU550, able of creating over 50.000 lumen of ...

Advanced packaging technologies such as chip on board (COB) and chip scale package (CSP) are driving the growth of LED packaging market The market for COB packages is expected to increase owing to its ...

The LED industry is ever moving towards more lumens/watt, lumens/$, lumens/area, better brightness, and improved color rendering index (CRI), sometimes called color rendition index. CRI is a ...

Study assesses the four major phosphor-LED types: ceramic, polymer, chip- on-board, and chip-scale. Washington, DC, USA -- If current trends in research and development continue, LED lighting is ...

Marktech Optoelectronics and manufacturing partner Optrans are introducing new transfer-moulded photodiode and LED packaging ...