The W-Series Matrix Connector is an interconnect pad for LGA devices with 200 or more circuit-board I/Os. The pad is inserted between the PCB and components to make electrical contact, eliminating the ...
The patented CSP/BallNest Hybrid Socket enables prototyping, test, or burn-in of CSP, BGA, microBGA, and LGA devices. The socket features a lid that nests each ball termination for connection ...
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