ORLANDO, Fla.--(BUSINESS WIRE)--Fonon, a multi-market holding company, R&D center, equipment designer and manufacturer of advanced laser material processing systems for subtractive and additive ...

Jenoptik has sold an emerging laser materials processing technology to fellow German company 3D-Micromac. The thermal laser separation technology, known as 'TLS-Dicing', can be used to separate ...

ORLANDO, Fla.--(BUSINESS WIRE)--Fonon Corporation, a multi-market holding company, R&D center, equipment designer and manufacturer of advanced laser material processing systems for subtractive and ...

The AVIA 355-23-250 UV laser is said to offer the highest pulse repetition rate of any Q-switched UV laser, allowing it to perform high-speed wafer-die singulation with high yields. The 355-nm laser ...

Germany-based engineering company Lidrotec has developed a novel laser dicing process alongside Trumpf, which has helped to scale the process for mass production of wafers using its laser and beam ...

Increasing the yield of wafers is one way to attack the current global chip shortage. One possibility to reduce losses is a laser processing method called wafer stealth dicing. Here, laser power is ...

Manufacturing of semiconductor chips involves cutting the wafers, first: The process is known as wafer dicing and produces “chips” or “die”. Typical challenges in wafer dicing applications include ...

TOKYO — In what could be a breakthrough in the chip-manufacturing process, Japan's Disco Corp. here today announced a new, automatic laser dicer tool for 300-mm fab applications. The DFL6360 from ...

The FINANCIAL — Panasonic Corporation, and Tokyo Seimitsu Co., Ltd. (hereinafter Tokyo Seimitsu) on March 12 announced that Tokyo Seimitsu and Panasonic’s subsidiary’s company, Panasonic Smart Factory ...

Dublin, Jan. 14, 2026 (GLOBE NEWSWIRE) -- The "Dicing Equipment Market 2026-2030" has been added to ResearchAndMarkets.com's offering. The global dicing equipment market is poised for substantial ...