YES proprietary process also results in defect-free solder reflow resulting in high throughput and low CoO. These results can extend bump-based mass reflow technology to sub-10um pitch” said Alex Chow ...

The solders used in the Electronic Industry are rapidly changing from Tin/Lead (Sn/Pb) solders to Lead-Free (Pb-Free) solders to meet new environmental and Green requirements. Many of these ...

Refuting a Reuters report citing five people stating that Samsung Electronics will apply Mass Reflow Molded Underfill (MR-MUF) technology, which is the process used by SK Hynix, Samsung sent out an ...