While ultra HDI may receive considerable attention for stacked vias, staggered vias are a smart choice in many designs. The structure, offsetting each microvia, permits the dielectric to absorb ...
BANNOCKBURN, IL—The proliferation of tighter microvia densities and signal integrity requirements in printed boards within the electronics industry has revealed reliability concerns with microvia ...
The MICROLAM 600 series—the 610, 620 and 630—microvia dielectric materials promise to increase mechanical reliability in portable products such as cell phones and PDAs. The company says the series ...
Consumers' escalating demand for more features in their small and mobile electronics products, such as PDAs and cell phones, is driving a need for smaller feature sizes, process geometries, and pc ...
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