Built 70% smaller than its predecessor, the ROK104001 Bluetooth multi-chip module has been developed to speed time-to-market by enabling designers to quickly implement qualified and tested Bluetooth ...
Multi-protocol wireless is emerging as a critical foundation for IoT, as integrated chips balance power, performance and ...
Qorvo, Inc. has launched three new highly integrated RF multi-chip modules (MCMs) designed for advanced radar applications. Leveraging Qorvo’s advanced packaging and process technology, the QPF5001, ...
Tesla has been granted a patent for a multi-chip module design featuring a Redistribution Layer substrate with IC dies mounted on both surfaces, sockets, and a cold plate. The innovative mounting ...
Osram Opto Semiconductors has introduced the first compact laser multi-chip package. The PLPM4 450 module can pack up to 20 blue laser chips into a single "butterfly" package for projection ...
TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...
ELMSFORD, N.Y.--(BUSINESS WIRE)--SEEQC, the digital quantum computing company, today introduced a family of high speed, energy-efficient Single Flux Quantum (SFQ) digital chips capable of running all ...
The higher-bandwidth, lower-latency and higher-reliability requirements of 5G mobile networks drive the need for higher-performance, higher-efficiency and lower-power–consumption 5G chips and modules.
For high performance applications, demand for highly integrated packages has increased. This is due to the highly integrated package’s electrical performance advantages of reduction of interchip ...
In a significant leap for India’s semiconductor ambitions, the country’s first commercially packaged multi-chip module (MCM) rolled out early Wednesday from Kaynes Semicon’s outsourced semiconductor ...
ANDOVER, Mass., March 18, 2024 (GLOBE NEWSWIRE) -- Mercury Systems, Inc. (MRCY) (NASDAQ: MRCY, www.mrcy.com), a technology company that delivers mission-critical processing power to the edge, today ...
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First India-made chip module sent to US firm AOS
India’s first commercially packaged multi-chip module (MCM) was rolled out of Kaynes Semicon’s outsourced semiconductor assembly and test (OSAT) facility in Sanand in the wee hours of Wednesday and ...
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