Systemwide I/O planning is an exercise in coordinating device placement with associated pin and net assignments across the chip-package-board system to maximize system quality for the target ...
Even though companies sell packaged devices and not bare chips, the chips are often designed in isolation and may be either overdesigned or too large to fit the package. When chip-level I/O planning ...
Just as floorplanning has become vital to the success of system-on-chip (SoC) design, package-aware I/O planning is essential for meeting cost, time-to-market and performance targets. Without such ...
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