Optical Profilometry employs light to measure surface contours and roughness by analyzing the interaction between light waves and the surface under examination. It utilizes various principles such as ...

Optical 3D metrology enables fast, non-contact surface roughness measurement of defects and roughness for precise ...

Chemical mechanical polishing (CMP) – also known as planarization – has long been the most commonly employed technique for smoothing and flattening wafer surfaces during the fabrication of ...

Surface properties dictate a vast array of material characteristics that are crucial to performance, durability, and intended functionality across diverse industries. Properties such as friction, wear ...

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