Modeling and simulation is an efficient way of analyzing packaging and testing processes to develop a strong understanding of how they may impact designs and performance. Multiphysics simulation ...
The federal award enables the High Density Electronics Center to upgrade its equipment and capabilities while conferring status as a Power Packaging Center of Excellence.
Power devices continue to evolve rapidly as SiC and GaN technologies become more efficient, integrated, and cost-effective. Meanwhile, steady improvements in MOSFET structures and processes enable ...
A new technical paper titled “Thermally Conductive Electrically Insulating Electronics Packaging for Water Immersion Cooling” was published by researchers at University of Illinois, Urbana, University ...
Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...
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