One of the most cutting-edge packaging technologies to recently emerge in the electronics marketplace is the quad flat no leads (QFN)-type package. It serves as an alternative to the more costly ...

Dublin, July 29, 2025 (GLOBE NEWSWIRE) -- The "eFuse Market by Type, Packaging Type, Application, Vertical, and Region - Global Forecast to 2030" has been added to ResearchAndMarkets.com's offering.

This application note presents thermal considerations for QFN package integrated circuits. It presents the QFN/PCB thermal structure, the optimization of thermal flag interface, the conduction paths ...

For high performance applications, demand for highly integrated packages has increased. This is due to the highly integrated package’s electrical performance advantages of reduction of interchip ...

With over 200 million motors produced every year with fractional horse power, the opportunity to save energy by adopting an electronically controlled variable speed solution is very significant. In ...