A technical paper titled “Fabrication and Characterization of Three-Dimensional Microelectromechanical System Coaxial Socket Device for Semiconductor Package Testing” was published by researchers at ...
The SG-BGA-7199 socket isdesigned for 13.5 x 8 x 1.2mm package size and operates at bandwidths up to 10GHz with less than 1dB of insertion loss. The contact resistance is typically20 milliohms per I/O ...
As semiconductor devices continue to advance, the demand for reliable, high-performance test sockets has never been greater. Yet, traditional socket design validation methods—such as per-pin ...
For leading-edge devices such as RF ICs, increasing frequency, package density, and thermal issues offer significant challenges to designing effective socket and load-board solutions for test.
Perforce Software recently released results of its first State of Semiconductors Report that looked at trends, challenges, and projections for the future of semiconductor design. The report, which ...
The global semiconductor market reached US$575.1 billion in 2022, but the figure only covers the IC design and IDM sectors. The entire semiconductor value chain should come close to US$1 trillion if ...
China has had a long history of supporting its semiconductor development with industrial policies. The "Outline for advancing the national IC industry" announced in 2014 upgraded semiconductors from a ...
At last month’s Fabless Semiconductor Association (FSA) Awards (the FSA is now the Global Semiconductor Association, or GSA), Gordon Campbell, recipient of the Dr. Morris Chang Exemplary Leadership ...
For engineers and startups in Malaysia, bringing a chip from concept to reality has long meant relying on overseas facilities. IC Design Park 2 in Cyberjaya is rewriting that story, offering a ...
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