Glass substrates are starting to gain traction in advanced packages, fueled by the potential for denser routing and higher signal performance than the organic substrates used today. There are still ...

Semiconductor glass substrates are drawing attention as a key material that can solve problems in the packaging domain, which has hit technical limits in the age of artificial intelligence (AI). Major ...

Advanced packaging technologies and high-bandwidth memory (HBM) have fueled a surge in global chip demand. Beneath the ...

Intel has revealed more details today about its "breakthrough" glass substrate technology - a new way to manufacture processors that promises numerous benefits to todays standard organic substrate ...

AMD has been granted a patent (12080632) that covers glass core substrate tech. Glass substrates will replace traditional organic substrates for multi-chiplet processors in the coming years. The ...

It's not just AMD, but Intel, Samsung, LG Innotek, and SK Group's US subsidiary Absolics are all systems pushing into glass substrate technology for advanced packaging. Intel announced in September ...

As a package substrate, the benefits of glass are substantial. It’s extremely flat with lower thermal expansion than organic substrates, which simplifies lithography. And that’s just for starters.

Copper surge squeezes Korea PCB profits, firms pivot toward glass substrates Korean pcb makers face margin squeeze from ...

Glass substrates help overcome limitations of organic materials by enabling an order of magnitude improvement in design rules needed for future data centers and AI products. SANTA CLARA, ...

Join the event trusted by enterprise leaders for nearly two decades. VB Transform brings together the people building real enterprise AI strategy. Learn more Intel said it has made a significant ...

TOKYO--(BUSINESS WIRE)--Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a Glass Core Substrate (GCS) targeting next-generation semiconductor packages. The new product replaces ...

Intel Corp. will build glass into its most advanced processors to make them faster and more power-efficient. The chipmaker detailed the plan today ahead of its annual Intel Innovation event, which is ...