The result is that the entire board is much denser, and comments can be installed on both sides of the PC board, as seen in Figure 2 . Since the board does not require drilling for component leads ...

This paper will address the optimization of Pb Free soldering conditions, with a focus on differences between Sn/ Pb and Pb Free soldering. This allows assemblers to build on their extensive ...

Assembling with a stencil is just that much more convenient – it’s a huge timesaver, and your components no longer need to be individually touched with a soldering iron for as many times as they have ...

LINCOLN, R.I.--(BUSINESS WIRE)--Aug. 8, 2006--The Solder Paste Group of EFD, Inc. and Leister Technologies LLC have agreed to a cooperative marketing effort for a unique, high-speed, high-precision, ...

Semiconductor die thickness is getting thinner over time due to improvement of power efficiency in advance power electronic packages. Ultrathin die with convex warpage can easily deteriorate the ...

Japanese storefront Shigezone has recently listed a USB PD (Power Delivery)-operated reflow oven. The top plate reaches a maximum temperature of 280 degrees Celsius at default settings or 350 degrees ...

[Jack Gassett] is developing a new breakout board for an FPGA. The chip comes in a ball grid array (BGA) package which is notoriously difficult to solder reliably. Since he’s still in development, the ...

The overall concept of reflow soldering is simple: put a pre-assembled board with some solder paste into an oven and bake it until the solder properly melts. When a board is reflowed, it typically is ...