Researchers in Sweden have analyzed how roll-bonded PVT collectors can act as secondary heat sources in ground-source heat pumps and have found they provide a better performance than conventional PVT ...

Rising chip and packaging complexity is causing a proportionate increase in thermal couplings, which can reduce performance, shorten the lifespan of chips, and impact overall reliability of chips and ...

Assessing individual components is the foremost step in system thermal analysis. A component's reported thermal-resistance data becomes the gauge for thermal evaluation and management. It is therefore ...

In materials science, thermal testing refers to the process of subjecting materials to analysis through thermal control in order to collect data on a wide range of properties. Generally, thermal ...

This whitepaper discusses the advantages of transient thermal test methods for IC package and thermal interface material (TIM) thermal characterization testing vs steady state methods. These methods ...