Dec 10, 2024 · DISCO CORPORATION, a semiconductor manufacturing equipment manufacturer (Head Office: Ota-ku, Tokyo; President: Kazuma Sekiya), has developed DKL7640, a fully …

Oct 23, 2023 · DISCO CORPORATION, a semiconductor manufacturing equipment manufacturer (Head Office: Ota-ku, Tokyo; President: Kazuma Sekiya), has developed a new ABC (Auto …

DISCO's increasing size and complexity was the main reason for the introduction of the system. When a company is small, communication is fluid and most employees know each other.

DISCO Technical Review 有关 Kiru（切）・Kezuru（削）・Migaku（磨）技术的见解和论文。

DISCO Technical Review 與Kiru（切）・Kezuru（削）・Migaku（磨）技術相關的見解‧論文之頁面。

This is an ingot slicing method where a separation layer (KABRA layer) is formed at a specified depth by continuously irradiating an ingot with a laser, producing wafers starting from the …

主要事業から独自の制度まで、ディスコをご理解いただくためにまずは知って欲しい10のキーワードをご紹介いたします。

DISCO’s Definition of Growth as a Company In addition, DISCO does not think of growth in terms of the expansion of the company’s sales, size, or market share. For DISCO, “growth” as …

Simple and compact single-axis grinder The DAG810 is a compact, automatic grinder for workpieces up to 8" in diameter. It has one spindle and one chuck table and is designed to …

Please contact a DISCO representative with your product needs such as type, wheel size, and quantity. When you place the first order with us, please explain application information such as …